Working surface: complete frontside
protected: Backside
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Product Sheet |
Instructions
| Dimension | 2" | 3" | 4" | 5" | 6" | 8" |
| A - length | 105 mm | 135 mm | 185 mm | 200 mm | 227 mm | 260 mm |
| B - total width | 65 mm | 87 mm | 132 mm | 145 mm | 160 mm | 212 mm |
| C - width neck | 65 mm | 50 mm | 80 mm | 80 mm | 80 mm | 80 mm |
| D - thickness | 12 mm | 12 mm | 12 mm | 14 mm | 14 mm | 14 mm |
| E - compl. thickness | 16 mm | 16 mm | 16 mm | 18 mm | 18 mm | 18 mm |
| F - edge exclusion | 5 mm | 5 mm | 5 mm | 5 mm | 5 mm | 5 mm |
Contacting: from backside
Contacts: within protected room
Working surface: complete frontside
protected: Backside
Horizontal wafer positioning during processing
BASIC:
Working surface: complete frontside
protected: Backside
PLUS
Working surface: frontside excl.
edge of 5 mm circumferential
BASIC-Twin
Stand Version
Simultaneous etching of 2 wafers
same size or different sizes
Working surface: complete frontside
protected: Backside
All silicet Wafer Holders are batch-qualified.
Type BASIC as well as type PLUS, whether
the wafer will be held and protected
with or without vacuum
Wafer fixing by a clip-ring.
Wafer is kept, not protected
To hold reticles while cleaning