silicet AG - electroplating

Basic-G

Contacting: from backside
Contacts: within protected room
Working surface: complete frontside
protected Backside

Dimension	2"	3"	4"	5"	6"	8"
A - length	105 mm	135 mm	185 mm	200 mm	227 mm	260 mm
B - total width	65 mm	87 mm	132 mm	145 mm	160 mm	212 mm
C - width neck	65 mm	50 mm	80 mm	80 mm	80 mm	80 mm
D - thickness	12 mm	12 mm	12 mm	14 mm	14 mm	14 mm
E - compl. thickness	44 mm	44 mm	44 mm	44 mm	44 mm	44 mm
F - edge exclusion	5 mm	5 mm	5 mm	5 mm	5 mm	5 mm

Double-sided

Electroplating of frontside and
backside simultaneously

Contacts: within protected room

Type I

Contacting: possible from both sides
Contacts: within protected room
Substrate format: angular

Special Sizes

Contacting: from frontside
Contacts: within protected room
Substrate format: user defined
With suspension device
Application: electroplating or LIGA

Batch Processing

Electroplating of 5 wafers simultaneously for example

Contacting: from frontside
Contacts: within protected room

Typ I

Contacting: from frontside
Contacts: within protected room
unprotected:Backside

Applicable for wafer holder and EP-Unit

Single Clip-G

Wafer fixing by Clip-ring,
broken to fit customized contact device
Wafer will be hold, not protected

Typ I
Typ II

Type I

Flexible for clamping constant
or even different formates

Basic-G

Plus-G

Pieces-G

System-G

Double-sided

Horizontal

Standversion

Current baffle

Type I

Type II

Special Sizes

Batch Processing

Typ I

Single Clip-G

Twin Clip-G

Conpro-G

Trio

Type I

Type II

Dimension	2"	3"	4"	5"	6"	8"
A - length	122 mm	145 mm	186 mm	239 mm	239 mm	313 mm
B - total width	80 mm	105 mm	132 mm	190 mm	190 mm	263 mm
C - width neck	80 mm	80 mm	80 mm	80 mm	84 mm	100 mm
D - thickness	12 mm	14 mm	14 mm	15 mm	15 mm	15 mm
E - compl. thickness	21 mm	22 mm	22 mm	22 mm	22 mm	24 mm
F - edge exclusion	5 mm	5 mm	5 mm	5 mm	5 mm	5 mm