Process Unit

The silicet process unit provides absolutely new options in wafer processing.
New: Even without vacuum management

Every possible wafer positioning while processing
can be realized. Even a horizontal application of
the anode above the wafer which could not been arranged
yet in a beaker or a bench.

Innovation for electroplating
The developed process unit allows a processing without a stress-free handling of thinnest Si-wafers as well as thick substrates. Thus the flexible unit included related options save an application of a complex and expensive bench.
The use of a silicet process unit means economic processing in the field of chemical wet etching as well as in the electroplating field. High process stability and high yield, short loading and unloading times and cycles. No wafer breakag and minimal consumption of partly dangerous solutions. With the silicet process unit any user-defined substrate sizes and shapes can be handled;
for example: wafer sizes 2" – 8"

The assembling of a transducer influences
the flow of the solution positively.
With the silicet process unit the whole process
takes place within a protected area.

• Due to the small area in front of the wafer the solution consumption is low cost savings
• Ideal energy input, due to small solution quantity to be tempered cost savings
• Avoidance of contact with dangerous toxic and aggressive solutions safety
• No outgassing due to closed system safety
• Small required space, easy to be moved
  flexibility
• uniform process conduct quality assurance