Plating Units

Standard Units for Wafer

Unit Features & Functions

Plating Unit

Single Wafer Processing from 2" - 12"

Batch Processing from 2" - 6"

Other Substrate Formats within the scope of a.m. size

Variable Parameters

Distance cathode : anode, all types of anodes available on request

Flow: adjustable 0.5 – 5 l/min, free or controlled flow by using a flow plate with defined layout

Temperature control

Adjustable shielding rings for each layout

Filter positioning in front of the cathode

Wafer cassette with circumferential dry contact. Processing of different wafer/substrate sizes in one unit

Inert gas atmosphere and air release system possible

Adjustable Parameters

Position anode : cathod

Flow forming

Independent current feed of different deposition areas

Minimization of Electrolyte Volume

Resource efficient

Less harmful to the environment

Cost saving

Modular Setup

Easy to be taken apart

Easy to clean Plating Process exchange within minutes

Customer-friendly replacement of all components

Standard Units Samples

12-inch-with-case

12 Inch with Case

Standard Units
8-inch-unit-60-turned

8 Inch Unit 60° turned

Standard Units
8-inch-unit-180-turned

8 Inch Unit 180° turned

Standard Units
6-unit-pmma

6 Inch Unit transparent

Standard Units
4-inch-side view

4 Inch Side View

Standard Units
12-6-4-inch-family

12-6-4 Inch Family

Standard Units

All components used are available as spare parts. If required, please contact us directly.

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